這是Fujifilm自去年(2008 ) Photokina 展出3D 數位相機之原型機約一年後,預計於今年88日正式上市,而且連同其3D數位相框一齊上市。

 

Fujifilm的官方網站 http://www.fujifilm.com/products/3d/index.html 所取得的資訊,我們可以發現Fujifilm在此3D產品確實下了一番工夫,其3D功能算是完備。除了可以拍攝3D靜態畫面外,也可以拍攝動態加聲音畫面,拍攝完成後,可以直接在相機調整視差與播放其3D效果,最後再藉由SD(或高速紅外線)3D影像傳送給它的專屬3D數位相框播放;甚至於可以將3D影像沖洗(製作)3D相片。

 

我個人對於這樣親和力強的人性化3D產品,給予高度的評價,因為市場上確實需要有這類型的3D產品來引導3D產業做正向的發展,不僅Fujifilm可以贏得消費者的掌聲,也可以為後來的跟隨者立下正面的示範作用,同時也為3D數位相框開出一條康莊大道。

 

愛爾得公司在3D產品的開發向來以嚴謹著稱,在「3D數位相框」也有一完整的3D關鍵技術支援。目前可以提供的有:(1)「裸眼3D立體影像顯示」用之3D光學鏡片 (2) 2D相片處理成3D相片的軟體 (3) 列印用之 3D相框。希望不久的將來,也有台灣製的高品質3D數位相框普及於全世界。

 

 

-JG (www.i-art.com.tw)

 

 

 


 

 

 


Fujifilm's 3D Camera Features Easy Parallax Adjustment Function

 

 

 

消息來源:http://techon.nikkeibp.co.jp/english/NEWS_EN/20090724/173391/  

Jul 24, 2009 14:25 Tomohiro Ootsuki, Nikkei Electronics

 

 

Fujifilm Corp will release what it claims is the world's first digital camera that enables to see three-dimensional pictures on the back monitor without special glasses Aug 8, 2009, in Japan (Fig 1).

 

The expected street price for the camera, "FinePix Real 3D W1," is about ¥60,000 (approx US$636). And the price of the "FinePix Real 3D V1," a 3D digital photo frame, is expected to be about ¥50,000. When purchased as a set, they will cost about ¥100,000.

 

The 3D camera is based on the prototype exhibited at photokina, a trade fair for the photographic and imaging industries, in 2008 (See related article). The largest difference from the prototype is a new user interface that enables to easily adjust parallax, which influences the effect of 3D representation.

 

Please see Fig 2 and 3. The width of the image shown on the LCD monitor is different in each picture. It is because I changed the degree of parallax by pressing the two buttons under the left thumb.

 

This time, Fujifilm realized such an easy method to adjust parallax anytime after taking a picture. As a result, it became easier for users to watch 3D pictures.

 

The FinePix Real 3D W1 features a function to automatically adjust parallax in accordance with the object of shooting. But the distances between the eyes and the monitor and between the two eyes differ in individuals. Therefore, the function to manually adjust parallax is convenient.

 

However, the camera is not currently equipped with a function that records each user's adjustment and automatically reproduces it in the next use.

 

With the method of taking two pictures at the same time, near- and long-distance pictures normally do not look three-dimensional enough. To address this issue, Fujifilm added new shooting modes, "3D double shooting" and "3D time-interval difference (TID) shooting."

 

The former mode requires the user to slightly move the camera and take a normal 2D picture twice by using one of the two camera modules. The latter mode is used, for example, to take a long-distance picture when the user is on a train or an airplane.

 

"Taking two pictures successively from different viewpoints provides stereoscopic effects to the pictures of grand sea of clouds and mountains seen from an airplane," Fujifilm said.

 

Furthermore, the company introduced new modes that allow users to change the settings of the two camera modules to take 2D pictures. They are "tele/wide simultaneous shooting," "two color simultaneous shooting" and "high-/low-sensitivity simultaneous shooting."

 

The following are the important points of the component mounting.

1. Fujifilm used an aluminum die-cast built-in frame to prevent the positional relationship between the two camera modules from changing (Fig 4, 5). The company called the frame "the core component of the 3D camera." Partly because of this built-in frame, the camera weighs 300g (including the battery and memory card), relatively heavier than other lens-integrated cameras.

2. The two camera modules have the same specifications (Fig 6), incorporating a flexible optical system. The recommended shooting distance for 3D pictures is more than 1m at the widest angle and more than 2m at the narrowest angle (when the automatic parallax adjustment function is on).

3. When I examined the exhibited main board, I thought the cost could be lowered by integrating and downsizing the substrates (Fig 7, 8). The number of connectors for flexible substrates is as many as 10, and the component density is not high enough.

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